TE Connectivity 2317857-2 Dust Cap / Cover & EMI AMP Osfp I/O Connectors Zinc Alloy Body

TE's octal small form-factor pluggable (OSFP) I/O connectors support aggregatedata rates up to 200 Gbps (8 x 28G NRZ) and 400 Gbps (8 x 56G PAM-4), with a roadmap to 112 Gbps PAM-4. They utilize integrated thermal heatsink technology in the plug to provide superior performance and signal integrity needed at 400G data rates and can fit 36 ports of an 8 lane interface in a 1RU switch form factor, aligning with current and next-generation silicon roadmaps

• Applications: Servers, Switches, Storage Devices, Routers etc.

Applications

Communications & Networking, Data / Computing, Industrial, Telecommunications

Other details

Brand	TE CONNECTIVITY
Part Number	2317857-2
Quantity	Each
3D Product Image EN
Drawing EN
CAD Multiple Formats EN

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