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ALLIANCE MEMORY AS4C64M8D2-25BIN DRAM, DDR2, 512 Mbit, 64M x 8bit, 400 MHz, FBGA, 60 Pins
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ALLIANCE MEMORY AS4C64M8D2-25BIN DRAM, DDR2, 512 Mbit, 64M x 8bit, 400 MHz, FBGA, 60 Pins

ALLIANCE MEMORY AS4C64M8D2-25BIN DRAM, DDR2, 512 Mbit, 64M x 8bit, 400 MHz, FBGA, 60 Pins

Product Overview

AS4C64M8D2-25BIN is a 512M � (64M x 8bit) DDRII synchronous DRAM (SDRAM). The 512Mb DDR2 SDRAM is a high-speed CMOS double-data-rate-two (DDR2), synchronous dynamic random-access memory (SDRAM) containing 512Mbits in an 8-bit wide data I/Os. It is internally configured as a quad bank DRAM, 4 banks x 16Mb addresses x 8 I/Os. The device is designed to comply with DDR2 DRAM key features such as posted CAS# with additive latency, write latency = read latency -1, and on-die termination (ODT). All of the control and address inputs are synchronized with a pair of externally supplied differential clocks. Inputs are latched at the cross point of differential clocks (CK rising and CK# falling). All I/Os are synchronized with a pair of bidirectional strobes (DQS and DQS#) in a source synchronous fashion. The address bus is used to convey row, column, and bank address information in RAS #, CAS# multiplexing style.

  • JEDEC standard compliant, supports JEDEC clock jitter specification
  • Fully synchronous operation, fast clock rate: 400MHz, differential clock, CK and CK#
  • Bidirectional single/differential data strobe, 4 internal banks for concurrent operation
  • 4-bit prefetch architecture, internal pipeline architecture, precharge and active power down
  • Programmable mode and extended mode registers, posted CAS# additive latency (AL): 0, 1, 2, 3, 4, 5
  • WRITE latency = READ latency - 1 tCK, burst lengths: 4 or 8 burst type: sequential/interleave
  • DLL enable/disable, on-die termination (ODT)
  • Auto refresh and self refresh, 8192 refresh cycles/64ms
  • 60 ball FBGA package
  • Industrial temperature range from -40°C to 95°C

Product details

Technical Specifications

DRAM Type

DDR2

Memory Configuration

64M x 8bit

IC Case / Package

FBGA

Supply Voltage Nom

1.8V

Operating Temperature Min

-40°C

Product Range

-

SVHC

No SVHC (27-Jun-2024)

Memory Density

512Mbit

Clock Frequency Max

400MHz

No. of Pins

60Pins

IC Mounting

Surface Mount

Operating Temperature Max

95°C

MSL

MSL 3 - 168 hours

Other details

Brand ALLIANCE MEMORY
Part Number AS4C64M8D2-25BIN
Quantity Each
Technical Data Sheet EN Download technical document - datasheet - Tanotis India

All product and company names are trademarks™ or registered® trademarks of their respective holders. Use of them does not imply any affiliation with or endorsement by them.
$15.01
ALLIANCE MEMORY AS4C64M8D2-25BIN DRAM, DDR2, 512 Mbit, 64M x 8bit, 400 MHz, FBGA, 60 Pins
$15.01

ALLIANCE MEMORY AS4C64M8D2-25BIN DRAM, DDR2, 512 Mbit, 64M x 8bit, 400 MHz, FBGA, 60 Pins

Product Overview

AS4C64M8D2-25BIN is a 512M � (64M x 8bit) DDRII synchronous DRAM (SDRAM). The 512Mb DDR2 SDRAM is a high-speed CMOS double-data-rate-two (DDR2), synchronous dynamic random-access memory (SDRAM) containing 512Mbits in an 8-bit wide data I/Os. It is internally configured as a quad bank DRAM, 4 banks x 16Mb addresses x 8 I/Os. The device is designed to comply with DDR2 DRAM key features such as posted CAS# with additive latency, write latency = read latency -1, and on-die termination (ODT). All of the control and address inputs are synchronized with a pair of externally supplied differential clocks. Inputs are latched at the cross point of differential clocks (CK rising and CK# falling). All I/Os are synchronized with a pair of bidirectional strobes (DQS and DQS#) in a source synchronous fashion. The address bus is used to convey row, column, and bank address information in RAS #, CAS# multiplexing style.

  • JEDEC standard compliant, supports JEDEC clock jitter specification
  • Fully synchronous operation, fast clock rate: 400MHz, differential clock, CK and CK#
  • Bidirectional single/differential data strobe, 4 internal banks for concurrent operation
  • 4-bit prefetch architecture, internal pipeline architecture, precharge and active power down
  • Programmable mode and extended mode registers, posted CAS# additive latency (AL): 0, 1, 2, 3, 4, 5
  • WRITE latency = READ latency - 1 tCK, burst lengths: 4 or 8 burst type: sequential/interleave
  • DLL enable/disable, on-die termination (ODT)
  • Auto refresh and self refresh, 8192 refresh cycles/64ms
  • 60 ball FBGA package
  • Industrial temperature range from -40°C to 95°C

Product details

Technical Specifications

DRAM Type

DDR2

Memory Configuration

64M x 8bit

IC Case / Package

FBGA

Supply Voltage Nom

1.8V

Operating Temperature Min

-40°C

Product Range

-

SVHC

No SVHC (27-Jun-2024)

Memory Density

512Mbit

Clock Frequency Max

400MHz

No. of Pins

60Pins

IC Mounting

Surface Mount

Operating Temperature Max

95°C

MSL

MSL 3 - 168 hours

Other details

Brand ALLIANCE MEMORY
Part Number AS4C64M8D2-25BIN
Quantity Each
Technical Data Sheet EN Download technical document - datasheet - Tanotis India

All product and company names are trademarks™ or registered® trademarks of their respective holders. Use of them does not imply any affiliation with or endorsement by them.

Product Information

Shipping & Returns

Description

Product Overview

AS4C64M8D2-25BIN is a 512M � (64M x 8bit) DDRII synchronous DRAM (SDRAM). The 512Mb DDR2 SDRAM is a high-speed CMOS double-data-rate-two (DDR2), synchronous dynamic random-access memory (SDRAM) containing 512Mbits in an 8-bit wide data I/Os. It is internally configured as a quad bank DRAM, 4 banks x 16Mb addresses x 8 I/Os. The device is designed to comply with DDR2 DRAM key features such as posted CAS# with additive latency, write latency = read latency -1, and on-die termination (ODT). All of the control and address inputs are synchronized with a pair of externally supplied differential clocks. Inputs are latched at the cross point of differential clocks (CK rising and CK# falling). All I/Os are synchronized with a pair of bidirectional strobes (DQS and DQS#) in a source synchronous fashion. The address bus is used to convey row, column, and bank address information in RAS #, CAS# multiplexing style.

  • JEDEC standard compliant, supports JEDEC clock jitter specification
  • Fully synchronous operation, fast clock rate: 400MHz, differential clock, CK and CK#
  • Bidirectional single/differential data strobe, 4 internal banks for concurrent operation
  • 4-bit prefetch architecture, internal pipeline architecture, precharge and active power down
  • Programmable mode and extended mode registers, posted CAS# additive latency (AL): 0, 1, 2, 3, 4, 5
  • WRITE latency = READ latency - 1 tCK, burst lengths: 4 or 8 burst type: sequential/interleave
  • DLL enable/disable, on-die termination (ODT)
  • Auto refresh and self refresh, 8192 refresh cycles/64ms
  • 60 ball FBGA package
  • Industrial temperature range from -40°C to 95°C

Product details

Technical Specifications

DRAM Type

DDR2

Memory Configuration

64M x 8bit

IC Case / Package

FBGA

Supply Voltage Nom

1.8V

Operating Temperature Min

-40°C

Product Range

-

SVHC

No SVHC (27-Jun-2024)

Memory Density

512Mbit

Clock Frequency Max

400MHz

No. of Pins

60Pins

IC Mounting

Surface Mount

Operating Temperature Max

95°C

MSL

MSL 3 - 168 hours

Other details

Brand ALLIANCE MEMORY
Part Number AS4C64M8D2-25BIN
Quantity Each
Technical Data Sheet EN Download technical document - datasheet - Tanotis India

All product and company names are trademarks™ or registered® trademarks of their respective holders. Use of them does not imply any affiliation with or endorsement by them.
ALLIANCE MEMORY AS4C64M8D2-25BIN DRAM, DDR2, 512 Mbit, 64M x 8bit, 400 MHz, FBGA, 60 Pins | Tanotis